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From the Editor: Drive to Squeeze More Power From Tiny Packages, On-Chip Substrates Continues Unabated

March 1, 2022 by Ashok Bindra

The fervor for miniaturization continues in the power sup- ply world. Power supply designers have kept pace with the demands of the market for more power from smaller packages with better efficiency, reliability, and speed. While keeping the cost low. Consequently, power integration, both in package and on-chip, has continued to evolve for more than a decade. The result is that power supply in package (PSiP) and power supply on-chip (PwrSoC) have be- come mainstream products, driven by traditional and emerging applications. Today, we are talking about hundreds of watts from a compact semiconductor package, as well monolithic semiconductor substrates.

For more about this article see link below. 

https://ieeexplore.ieee.org/document/9715969

For the open access PDF link of this article please click here.

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IEEE Power Electronics Magazine publishes peer-reviewed articles related to power electronics and its applications which encompass the effective use of electronic components, application of control theory and circuit design techniques, and the development of analytical tools used in efficient and effective energy conversion, control, utilization, and conditioning of electric power.

The IEEE Power Electronics Magazine is limited to the field of interest of the IEEE Power Electronics Society. Topics also include publication of new trend technologies that are being pursued by industry, design practices and case studies, significant amount of state of the art surveys tutorials, and non-technical contributions: news about society activities, interviews, and historical articles.

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To educate, inform, and entertain our community of IEEE Power Electronics Society members on technology, events, industry news, and general topics relating to consumer electronics and to further serve and support our Members in professional career development through tutorials and raising awareness of engineering tools and technologies.

The magazine is archived in IEEE Xplore, and articles from all issues are available for download.

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