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ROHM’s 4G SiC MOSFETs Qualified for SEMIKRON’s eMPack Modules Targeting Next Generation EVs

July 18, 2022 by Ashok Bindra

Nuremberg, Germany based power modules maker SEMIKRON has announced that ROHM Semiconductor’s fourth generation (4G) silicon carbide (SiC) MOSFETs have been fully qualified in SEMIKRON’s eMPack modules for automotive use. Concurrently, SEMIKRON also secured a billion-Euro (U.S. $1.01 billion) contract to supply its innovative eMPack power modules to a major German car maker, beginning in 2025. Meanwhile, for eMPack, the company has developed a fully sintered assembly and connection technology ‘Direct Pressed Die’ (DPD), which enables extremely compact, scalable and reliable traction inverters, said SEMIKRON. The eMPack module technology has been specially designed for SiC-based converters of medium and high power in order to fully exploit the properties of the new semiconductor material. ROHM’s 4G SiC MOSFETs include 750 V and 1200 V devices.

FIG 1 SEMIKRON offers evaluation board for eMPack that incoirporates ROHM’s 4G SiC MOSFETs and gate driver ICs.

In addition, SEMIKRON has readied evaluation boards (Figure 1) for eMPack that incorporates ROHM’s gate driver ICs, in addition to 4G SiC MOSFETs, helping customers shorten the time required for evaluation and adoption. In the future, SEMIKRON said that it also plans to use ROHM’s IGBTs in modules for industrial applications.

“Thanks to ROHM’s SiC technology, SEMIKRON’s innovative eMPack family of power modules is ready to make a significant contribution to reducing emissions through e-mobility,” said Karl-Heinz Gaubatz, CEO and CTO at SEMIKRON. “ROHM’s SiC technology provides more efficiency, performance and reliability in automotive and also industrial applications.”

ROHM produces SiC components in-house in a vertically integrated manufacturing system and thus delivers high quality, energy-saving products while achieving a constant market supply. ROHM’s production subsidiary SiCrystal, located in Nuremberg, Germany, plans to expand its SiC wafer capacities and human resources – to produce several 100,000 substrates a year.

In a statement, ROHM Co., Ltd.’s president and CEO Isao Matsumoto said, “We are glad that SEMIKRON has selected ROHM as SiC supplier for the automotive qualified eMPack. This partnership leads to a competitive solution for inverter application use inside electrical vehicles.”  “ROHM offers a broad portfolio of SiC devices – from chips to packages. As the demand for SiC will continue to grow, ROHM will accelerate further investment and product development based on the technology we have cultivated as a leading SiC manufacturer. In addition, our company will continue to propose solutions and deliver customer support,” added Matsumoto.

According to ROHM, it’s latest 4G SiC MOSFETs, which has been adopted by SEMIKRON, provides industry-leading low ON resistance with improved short-circuit withstand time. These characteristics contribute significantly to extend the driving length and miniaturize the batteries of EVs when they are used in traction inverters. 

Both companies will continue to contribute to automotive technology innovations by providing optimal power solutions that meet market needs through the fusion of ROHM’s device/control technologies and SEMIKRON’s module technologies.

 

Filed Under: Industry News

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About the Magazine

IEEE Power Electronics Magazine publishes peer-reviewed articles related to power electronics and its applications which encompass the effective use of electronic components, application of control theory and circuit design techniques, and the development of analytical tools used in efficient and effective energy conversion, control, utilization, and conditioning of electric power. The IEEE Power Electronics  Magazine is limited to the field of interest of the IEEE Power Electronics Society. Topics also include publication of new trend technologies that are being pursued by industry, design practices and case studies, significant amount of state of the art surveys tutorials, and non-technical contributions: news about society activities, interviews, and historical articles.

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With the growing concerns of the worldwide coronavirus pandemic, the IEEE Power Electronics Society/Industrial Applications Society (PELS/IAS) and Power Supply Manufacturers Association-sponsored 2020 Applied Power Electronics Conference and Exposition (APEC 2020) in New Orleans, Louisiana, was cancelled for the safety of the attendees. While it was a difficult decision, the health, safety, and welfare of the community was paramount for the organizers and sponsors of the 15–19 March 2020 conference. Although this was the first such cancellation in APEC’s 35-year history, the organizers were quick to offer a virtual conference to those registered. In addition, peer-reviewed papers accepted by the conference committee were submitted to IEEE Xplore and are available to all.

Despite the challenges and adversities of COVID-19, the organizers worked diligently to virtually bring the conference and its presentations to the registered community via the APEC 2020 app and the eventScribe web portal. As a result, I was given a password (access key) to access the site and view a variety of the sessions. Before I go through the conference papers and sessions, I would like to take the opportunity to mention the vendors who promptly called IEEE Power Electronics Magazine and presented the latest trends in technologies and products online. The unbelievable situation created by the COVID-19 outbreak did not deter the vendors and emerging companies from taking their latest advances and developments to editors and reporters via phone and virtual meetings and booths. As a result, I was lucky to talk to a variety of power semiconductor companies, passive component suppliers, and power electronics experts, including marketing analysts, and gather the latest advances in power electronics technology.

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IEEE Power Electronics Society members
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