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IEEE Power Electronics Magazine

Unboxing the technology behind smart consumer electronics systems.

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Features

Machine-Learning-Based Condition Monitoring of Power Electronics Modules in Modern Electric Drives

March 15, 2023 by Dinan Li

Integrating machine-learning (ML) models responsible for predicting the evolution of those directly collected or implicitly derived parameters enhances the smartness of industrial systems even further. In this article, data already residing in most modern electric drives has been used to establish a data-driven thermal model of power electronics modules. The developed method … [Read more...] about Machine-Learning-Based Condition Monitoring of Power Electronics Modules in Modern Electric Drives

Selecting the Best Magnetic Core Geometry

March 15, 2023 by Ira J. Pitel

Selecting the best core geometry for a given application can be challenging given all the options available. For high-frequency applications using ferrite and other low loss materials, many different shapes are available from core manufacturers. For power electronics applications, frequencies are not constrained to power line frequencies leading to more complex core designs. … [Read more...] about Selecting the Best Magnetic Core Geometry

FEPPCON XI – Part II: Reliability of Power Electronic Systems

March 15, 2023 by Huai Wang

To be cost effective and safe, reliability design, test and health monitoring and management are a necessary part of power electronics implementation and its integration into energy systems. Being able to design power electronics to meet a required lifetime for a given load profile with a certain probability becomes acheiveable as we understand the physics of failure in power … [Read more...] about FEPPCON XI – Part II: Reliability of Power Electronic Systems

FEPPCON XI—Part II: Technical Committee Scope: Road Mapping Exercise

March 15, 2023 by Pat Wheeler

The IEEE Power Electronics Society (PELS) currently has twelve Technical Committees (TC) covering a range of technical and application areas of power electronic systems. The number of TCs was increased from seven to twelve in 2020, reflecting the global growth in power electronics in terms of scope and application. The TCs provide a community home for power electronics … [Read more...] about FEPPCON XI—Part II: Technical Committee Scope: Road Mapping Exercise

Power Conversion Systems Enabled by SiC BiDFET Device

March 15, 2023 by Subhashish Bhattacharya

The BiDirectional Field-Effect Transistor (BiDFET) can enable circuit topologies requiring four-quadrant switches, that were earlier designed using discrete combinations of MOSFETs, IGBTs, GaN HEMTs, and PiN diodes. The monolithic nature of the BiDFET allows lower device count, smaller switch volume, lower inductance, and simpler packaging, and hence more reliable and … [Read more...] about Power Conversion Systems Enabled by SiC BiDFET Device

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About the Magazine

IEEE Power Electronics Magazine publishes peer-reviewed articles related to power electronics and its applications which encompass the effective use of electronic components, application of control theory and circuit design techniques, and the development of analytical tools used in efficient and effective energy conversion, control, utilization, and conditioning of electric power.

The IEEE Power Electronics Magazine is limited to the field of interest of the IEEE Power Electronics Society. Topics also include publication of new trend technologies that are being pursued by industry, design practices and case studies, significant amount of state of the art surveys tutorials, and non-technical contributions: news about society activities, interviews, and historical articles.

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To educate, inform, and entertain our community of IEEE Power Electronics Society members on technology, events, industry news, and general topics relating to consumer electronics and to further serve and support our Members in professional career development through tutorials and raising awareness of engineering tools and technologies.

The magazine is archived in IEEE Xplore, and articles from all issues are available for download.

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